
More about Moore's law
Moore’s Law was first articulated in 1965, when Gordon Moore observed that the number of components on integrated circuits had been doubling at regular intervals, based on early industry data. In a landmark paper, he projected that this trend would continue for at least a decade—a prediction that proved remarkably accurate and was later refined to a doubling approximately every two years. Moore’s Law thus reflects an exponential scaling paradigm in semiconductor technology, where transistor density doubles approximately every two years. This implies a continuous reduction in feature sizes and an associated increase in functionality per unit area, driving improvements in performance, power efficiency and cost.
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For more than half a century, Moore’s law has captured the semiconductor industry’s ambition: to double the functionality of chips roughly every two years. Turning that ambition into reality has become increasingly challenging as critical dimensions push deep into the atomic scale. The 14AMI project takes up this challenge by developing the technologies needed for the 14 Ångström CMOS node. Bringing together world-leading expertise in EUV lithography, holistic metrology and advanced device integration, 14AMI aims to demonstrate a fully integrated Complementary FET (CFET) device and the associated process control infrastructure. In doing so, the project not only extends the Moore’s law trajectory, but also embeds sustainability at the heart of next-generation manufacturing — from PFAS-free resists and smarter vacuum sensing to more energy-efficient, high-throughput tools. 14AMI is where continued scaling, industrial competitiveness and responsible innovation converge.

14AMI in the Continuum of European JU Scaling Projects advancing Moore’s Law
14AMI is not a standalone initiative. It is one of the most recent projects in a coherent series of European, Joint Undertaking–supported programs aimed at sustaining Moore’s-law scaling by continuously advancing semiconductor manufacturing capabilities. Earlier projects were executed under predecessor Joint Undertakings such as ECSEL and KDT, creating a stepwise roadmap of technology development and integration. In this sequence, ID2PPAC was the final project before 14AMI was launched under the CHIPS Joint Undertaking, ensuring continuity in collaboration, knowledge build-up, and progress toward further chip miniaturization.