About the 14AMI project
The 14AMI project is about creating technological solutions for the 14 Angstrom CMOS technology node, including a fully integrated functional CFET (Complementary Field Effect Transistor) as new active CMOS device, and state-of-the-art holistic metrology techniques for both wafer and mask inspection and review. All is aimed to keep the pace in the industry to follow “Moore’s law”. The project addresses the following 3 main pillars that are relevant in enabling manufacture of 14A technology, 1) lithography, 2) metrology and 3) process module integration.
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In lithography the aim is to realize solutions for the 0.55NA EUV scanner platform to secure 14Angstrom node compliance in performance, that is, resolution, alignment, throughput and optics lifetime.
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In Metrology the objective is to cover wafer and mask metrology and quality control. The aim is to develop holistic metrology, tools & methods and data analytics to improve overlay, CD and focus measurement and quality control with a Precision to Tolerance, P/T, ratio between 0.1 and 0.3.
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In process module integration work covers the realization and demonstration of a CFET – Complementary Field Effect Transistor - CMOS device. Three options will be investigated for integration; a monolithic, sequential and a hybrid solution.
In addition, the partners will develop a PFAS-free photo resist to reduce the ecological footprint of photolithography processes, and a smart AI based sensor technology to improve vacuum chambers' efficiency and reduce waste.
At societal level the expected impact of the 14AMI project will support the partners and their supplier network to stay at the leading edge of high-tech developments, crucial to meet the digitization challenges of the European society. Moreover, 14AMI will “boost industrial competitiveness”, and attract talent in Europe, while enabling new application in areas such as security, communication and enabling of further automation in mobility, health and research.
Project structure
The 14AMI project is structured into four closely connected work packages (WPs) that together address the key challenges for 14Å-node technology.
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WP1 provides overall project coordination and technical steering, manages innovation/IP and data management, and ensures dissemination and exploitation of results.
The technical work is covered by three work packages:
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WP2 develops 0.55NA EUV lithography solutions aiming at single-patterning for the 14Å node
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WP3 develops holistic wafer- and mask-level metrology and integrated (AI/non-AI) data methodologies to enable feedforward/feedback process control
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WP4 integrates technology modules towards CFET device demonstrations (monolithic, sequential, and hybrid options) while also advancing sustainability enablers such as PFAS-free resists, more sustainable mask solutions, and smart sensor technology for vacuum process chambers.
The WPs are interrelated through iterative loops: lithography capabilities from WP2 are measured and optimized via WP3, and then validated and integrated in WP4, with WP1 coordinating progress, alignment, and impact throughout.
Project consortium
The 14AMI consortium comprises 31 participating organizations from academia, research and technology organizations, small and medium enterprises and large companies. The consortium spans eight countries, including six EU member states. The consortium members cover the entire value chain for the manufacturing of 14 angstrom node CMOS chips, from chip design to lithography to process technology and metrology.