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Applied Materials Israel Ltd
About the company

Applied Materials Israel Ltd.  is a subsidiary of Applied Materials inc. (AMAT) and serves as a global center of excellence for process diagnostics, control, inline metrology, and inspection technologies for semiconductor manufacturing. Headquartered in Rehovot, with over 2300 employees, Applied Materials Israel is the largest R&D site outside the US and is home to the Process Diagnostics and Control (PDC) business unit, where multidisciplinary teams develop, manufacture, and support cutting‑edge e‑beam and optical metrology, inspection, and process‑control systems used in leading‑edge wafer fabrication. Our technical expertise spans optical microscopes, scanning electron microscopes, advanced image processing, machine learning, deep learning and AI algorithms, precision mechanics, robotics, and complex system integration. We are the only company serving all inline high-volume manufacturing e-beam metrology and inspection segments and considered the leading e-beam company. We combine R&D laboratories with on‑site manufacturing cleanrooms, supporting rapid innovation cycles and close collaboration with global customers. Our solutions are deployed in high‑volume manufacturing fabs and are critical for enabling process control, yield, and productivity at advanced technology nodes, including EUV‑based patterning. In addition to R&D and manufacturing, we provide customer support and field engineering services at major world-wide semiconductor manufacturing sites, ensuring deployment and continuous optimization of complex production tools. Our systems and solutions play a strategic role in advancing semiconductor manufacturing technologies and enable the next generations of logic and memory devices.

Project contribution


Applied Materials Israel Ltd. is an industrial partner in the 14AMI project, contributing to the development of advanced e‑beam and optical metrology, inspection, and process‑control technologies and applications that are essential for enabling the 14Å technology node. Applied’s developments support the project’s objectives of achieving manufacturable, high‑yield advanced logic devices.

Within the project’s metrology activities, these contributions include:

(1) the development of a next‑generation CD‑SEM metrology system;
(2) the development of aerial mask imaging and metrology capabilities that enable large‑scale extraction of wafer‑level critical dimension and pattern‑fidelity information without printing wafers, thereby significantly reducing cycle time, cost, and resource consumption; and
(3) the development of in‑situ optical wavefront characterization and control scheme for high‑end optical defect inspection tools in production environments.

Contact

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