EV Group GmbH
About the company
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base – from the initial development through to the final integration at the customer’s site.
Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world, with more than 1700 employees worldwide and fully-owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan and Singapore.
Project contribution
EVG successfully delivered beyond–state‑of‑the‑art process modules and tooling, enabling high‑precision alignment and ultra‑low distortion with specialized bond chucks. The complete process flow, including advanced correction algorithms, was fully implemented on high‑volume manufacturing (HVM) equipment, demonstrating EVG’s leadership in production‑ready precision wafer bonding.
In addition, EVG introduced new modules, software, and tooling for aligned bonding platforms specifically optimized for next‑generation CFET integration schemes, reinforcing its position at the forefront of advanced device integration.
EVG further advanced IR laser–based release processes which were successfully implemented and validated on pilot equipment.
Moreover, EVG comprehensively investigated the influence of different dielectrics, including low-k materials, on fusion bonding process compatibility. The results defined the specifications for new process modules and bond chucks.